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? product structure : semiconductor ic ? this product is not designed prot ection against r adioactive rays . 1/21 tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 tsz22111 14 001 http://www.rohm.com for air-conditioner fan motor 3-phase brushless fan motor driver bm6203fs general description this motor driver ic adopts prestomos? as the output transistor, and put in a small full molding package with the high voltage gate driver chip. the protection circuits for overcurrent, overheating, under voltage lock out and the high voltage bootstrap diode with current regulation are built-in. it provides optimum motor drive system for a wide variety of applications by the combination with controller bd6201x series and enables motor unit standardization. features ?? 600v prestomos? built-in ?? output current 2.5a ?? bootstrap operation by floating high side driver (including diode) ?? 3.3v logic input compatible ?? protection circuits provided: ocp, tsd and uvlo ?? fault output (open drain) applications ?? air conditioners; air cleaners; water pumps; dishwashers; washing machines ?? general oa equipment key specifications ?? output mosfet voltage: 600v ?? driver output current (dc): 2.5a (max) ?? driver output current (pulse): 4.0a (max) ?? output mosfet dc on resistance: 1.7 ? (typ) ?? operating case temperat ure: -20c to +100c ?? junction temperature: +150c ?? power dissipation: 3.00w package w (typ) x d (typ) x h (max) ssop-a54_23 22.0 mm x 14.1 mm x 2.4 mm typical application circuit ssop-a54_23 figure 1. application circuit example - bm6203fs & bd6201xfs r8 r9 vreg vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc bd6201xfs bm6203fs r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14
2/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 block diagram and pin configuration figure 2. block diagram figure 3. pin configuration (top view) pin descriptions (nc: no connection) pin name function pin name function 1 vcc low voltage power supply 23 vdc high voltage power supply 2 fob fault signal output (open drain) - vdc 3 uh phase u high side control input 22 bu phase u floating power supply 4 ul phase u low side control input - u 5 nc 21 u phase u output 6 vh phase v high side control input 20 bv phase v floating power supply 7 vl phase v low side control input - v 8 nc 19 v phase v output 9 nc - vdc 10 wh phase w high side control input 18 vdc high voltage power supply 11 wl phase w low side control input 17 bw phase w floating power supply 12 fob fault signal output (open drain) - w 13 vcc low voltage power supply 16 w phase w output 14 gnd ground 15 pgnd ground (current sense pin) note) all pin cut surfaces visible from the side of package ar e no connected, except the pin nu mber is expressed as a ?-?. vcc fob uh ul vh vl wh wl fob vcc gnd pgnd w bw vdc v bv u bu vdc pgnd level shift & gate driver bu u m 22 21 1 vcc gnd vdc 3 uh 4 ul bv v 20 19 6 vh 7 vl bw w 17 16 10 wh 11 wl 2 fob 12 fob 13 vcc vdc 15 14 fault sdb level shift & gate driver fault sdb level shift & gate driver fault sdb trip 18 vdc vcc 23 fault trip trip
3/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 functional descriptions 1. control input pins (uh, ul, vh, vl, wh, wl) the input threshold voltages of the control pins are 2.5v and 0.8v, with a hysteresis voltage of approximately 0.4v. the ic will accept input voltages up to the vcc voltage. when the same phase control pins are input high at the same time, the high side and low side gate driver outputs become low. dead time is installed in the control signals. the control input pins are connected in ternally to pull-down resistors (100k ? nominal). however, the switching noise on the output stage may affect the input on these pins and cause undesired operation. in such cases, attaching an external pull-down resistor (10k ? recommended) between each control pin and ground, or connecting each pin to an input voltage of 0.8v or less (preferably gnd), is recommended. 2. under voltage lock out (uvlo) circuit to secure the lowest power supply voltage necessary to o perate the driver, and to preven t under voltage malfunctions, the uvlo circuits are independently built into the upper side floating driver and the lower side driver. when the supply voltage falls to v uvl or below, the controller forces driver outputs low. when the voltage rises to v uvh or above, the uvlo circuit ends the lockout operation and returns the chip to nor mal operation. even if the controller returns to normal operation, the output begins from the following control input signal. figure 4. low voltage monitor - uvlo - timing chart truth table hin lin ho lo l l l l h l h l l h l h h h inhibition note) hin: uh,vh,wh, lin: ul,vl,wl vcc hin lin ho lo vb hin lin ho lo v ccuvh v ccuvl v buvh v buvl
4/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 3. bootstrap operation figure 5. charging period figure 6. discharging period the bootstrap is operated by the charge period and the di scharge period being alternately repeated for bootstrap capacitor (cb) as shown in the figure above. in a word, th is operation is repeated while the output of an external transistor is switching with synchronous re ctification. because the suppl y voltage of the floating driver is charged from the vcc power supply to cb through prevention of backflow diode dx, it is approximately (vcc-1v). the resistance series connection with dx has the impedance of approximately 200 ? . the capacitance value for the bootstrap is the following formula: nf36 v qq2 f )ii( ?? ?c drop loss g pwm lbd bbq boot ? ? ??? ? where, for example: i bbq is the floating driver power supply quiescence current, 150a(max) i lbd is the bootstrap diode reverse bias current, 10a(max) f pwm is the carrier frequency, 20khz q g is the output mosfet total gate charge, 50nc(max) q loss is the floating driver transmission loss, 1nc(max) ? v drop is the drop voltage of the floating driver power supply, 3v the allowed drop voltage actually becomes smaller by the range of the used power suppl y voltage, the output mosfet on resistance, the forward voltages of the internal boot diode (the drop voltage to the capacitor by the charge current), and the power supply voltage monitor circuits etc. please set the calculation value to the cr iterion about the capacitance value tenfold or more to secure the margin in considerat ion of temperature characterist ics and the value change, etc. moreover, the example of the mentioned above assumes the synchronous rectification switching. because the total gate charge is needed only by the carrier frequ ency in the upper switching section, for example 150 commutation driving, it becomes a great capacity shortage in the above settings. please set it after confirming actual application operation. 4. thermal shutdown (tsd) circuit the tsd circuit operates when the junction temperature of the gate driver exceeds t he preset temperature (150c nominal). at this time, the controller forces all driver outputs low. since thermal hy steresis is provided in the tsd circuit, the chip returns to normal operation when the junction temper ature falls below the preset temperature (125c nominal). the tsd circuit is designed only to shut the ic off to prev ent thermal runaway. it is not designed to protect the ic or guarantee its operation in the presen ce of extreme heat. do not continue using t he ic after the tsd circuit is activated, and do not use the ic in an environment where activation of t he circuit is assumed. moreover, it is not possible to follow the output mosfet junction temperature risi ng rapidly because it is a gate driver ch ip that monitors the temperature and it is likely not to function effectively. 5. overcurrent protection (ocp) circuit the overcurrent protection circuit can be activated by connec ting a low value resistor for current detection between the pgnd pin and the gnd pin. when the pgnd pin voltage reaches or surpasses the threshold value (0.9v typical), the gate driver outputs low to the gate of a ll output mosfets, thus initiating th e overcurrent protection operation. c b :w ho :w vs :w vdc :w vb :w l :w h :w dx :w lo :w off :w on :w vcc :w c b :w ho :w vs :w vdc :w vb :w h :w l :w dx :w lo :w on :w off :w vcc :w
5/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 6. fault signal output when the gate driver detects either state that should be protected (uvlo / tsd / ocp), the fob pin outputs low (open drain) for at least 25s nominal. the fob pin has wired-or c onnection with each phase gate driver chip internally, and into another phase also entering the prot ection operation. even when this function is not used, the fob pin is pull-up to the voltage of 3v or more and at least a resistor with a value 10k ? or more. moreover, the signal from the outside of the chip is not passed because of the built-in analog filter, but the internal control signals (uvlo / tsd / ocp) pass the filter (2.0s min.) for the malfunction prevention by the switching noise, etc. figure 7. fault signal bi-directional input pin interface figure 8. fault operation ~ ocp ~ timing chart the release time from the protection operation can be changed by inserting an external capacitor. refer to the formula below. release time of 5ms or more is recommended. cr) vpu 0.2 1ln(t ????? [s] figure 9. release time setting application circuit figure 10. release time (reference data @r=100k ? ) hin lin pgnd ho lo fob 0.9v(typ) 2.0s (min) 25s (typ) 2.0s (min) 25s (typ) fob shutdown tsd ocp uvlo filter fault fob vpu r c 0 1 2 3 4 5 6 7 8 9 10 0.01 0.10 1.00 capacitance : c[f] release time : t [ms] vpu =5 v vpu =1 5 v
6/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 fob vreg fib bd6201xfs bm6203fs 100k c when using controller bd6201x series as a control ic, the fob pin can be linked to the external fault signal input pin of the side of the control ic sinc e it has the internal pull-up resistor. refer to figure 11. figure 11. interface equivalent circuit 7. switching time figure 12. switching time definition parameter symbol reference unit conditions t dh(on) 770 ns t rh 130 ns t rrh 180 ns t dh(off) 660 ns high side switching time t fh 30 ns t dl(on) 830 ns t rl 140 ns t rrl 180 ns t dl(off) 740 ns low side switching time t fl 30 ns vdc=300v, vcc=15v, i d =1.25a vin= 0v? 5v, inductive load xh, xl v ds i d t on t d(on) t r t rr t d(off) t off t f 10% 90% 10% 90%
7/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 absolute maximum ratings (ta=25c) ratings parameter symbol bm6203fs unit output mosfet v dss 600 (note 1) v supply voltage v dc -0.3 to +600 (note 1) v output voltage v u , v v , v w -0.3 to +600 (note 1) v high side supply pin voltage v bu , v bv , v bw -0.3 to +600 (note 1) v high side floating supply voltage v bu -v u , v bv -v v , v bw -v w -0.3 to +20 v low side supply voltage v cc -0.3 to +20 v all others v i/o -0.3 to v cc v driver outputs (dc) i omax(dc) 2.5 (note 1) a driver outputs (pulse) i omax(pls) 4.0 (note 2) a fault signal output i omax(fob) 15 (note 1) ma power dissipation pd 3.00 (note 3) w thermal resistance r thj-c 15 c/w operating case temperature t c -20 to +100 c storage temperature t stg -55 to +150 c junction temperature t jmax 150 c (note) all voltages are with respect to ground. (note 1) do not, however, exceed pd or aso. (note 2) pw 10s, duty cycle 1% (note 3) mounted on a 70mm x 70mm x 1.6mm fr4 glass-epoxy board wi th less than 3% copper foil. derated at 24mw/c above 25c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. operating conditions (tc=25c) range parameter symbol min. typ. max. unit supply voltage v dc - 310 400 v high side floating supply voltage v bu -v u , v bv -v v , v bw -v w 13.5 15 16.5 v low side supply voltage v cc 13.5 15 16.5 v minimum input pulse width t min 0.8 - - s dead time t dt 1.5 - - s shunt resistor (pgnd) r s 0.5 - - ? junction temperature t j - - 125 c (note) all voltages are with respect to ground.
8/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 electrical characteristics (unless otherwise specified, ta=25c and vcc=15v) limits parameter symbol min. typ. max. unit conditions power supply hs quiescence current i bbq 30 70 150 a xh=xl=l, each phase ls quiescence current i ccq 0.4 0.9 1.5 ma xh=xl=l output mosfet d-s breakdown voltage v (br)dss 600 - - v i d =1ma, xh=xl=l leak current i dss - - 100 a v ds =600v, xh=xl=l dc on resistance r ds(on) - 1.7 2.5 ? i d =1.25a diode forward voltage v sd - 1.1 1.5 v i d =1.25a bootstrap diode leak current i lbd - - 10 a v bx =600v forward voltage v fbd 1.5 1.8 2.1 v i bd =-5ma, including series-r series resistance r bd - 200 - ? control inputs input bias current i xin 30 50 70 a v in =5v input high voltage v xinh 2.5 - vcc v input low voltage v xinl 0 - 0.8 v under voltage lock out hs release voltage v buvh 9.5 10.0 10.5 v v bx - v x hs lockout voltage v buvl 8.5 9.0 9.5 v v bx - v x ls release voltage v ccuvh 11.0 11.5 12.0 v ls lockout voltage v ccuvl 10.0 10.5 11.0 v overcurrent protection threshold voltage v sns 0.8 0.9 1.0 v fault output output low voltage v fol - - 0.8 v i o =+10ma input high voltage v finh 2.5 - vcc v input low voltage v finl 0 - 0.8 v noise masking time t mask 2.0 - - s
9/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 typical performance curves (reference data) 40 60 80 100 120 140 12 14 16 18 20 supply voltage : v bx -v x [v] supply current : i qvbx [a] _ 125c 25c -25c 1.5 2.0 2.5 3.0 3.5 12 14 16 18 20 supply voltage : vcc [v] supply current : icc [ma] 125c 25c -25c 1.0 1.5 2.0 2.5 3.0 12 14 16 18 20 supply voltage : vcc [v] supply current : icc [ma] 125c 25c -25c figure 15. low side drivers operating current figure 16. quiescence current (f pwm : 20khz, two-phase switching) (high side driver, each phase) figure 13. quiscence current figure 14. low side drivers operating current (low side drivers) (f pwm : 20khz, one-phase switching) 0.5 1.0 1.5 2.0 2.5 12 14 16 18 20 supply voltage : vcc [v] supply current : icc [ma] 125c 25c -25c
10/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 typical performance curves (reference data) - continued 0 5 10 15 20 1.0 1.5 2.0 2.5 input voltage : v in [v] internal logical voltage : v out [v] 125c 25c -25c figure 19. input threshold voltage figure 20. overcurrent detection voltage (uh,ul,vh,vl,wh,wl,fob) figure 17. high side driver operating current figure 18. input bias current (f pwm : 20khz, each phase) (uh,ul,vh,vl,wh,wl) 200 250 300 350 400 450 500 12 14 16 18 20 supply voltage : v bx -v x [v] supply current : i qvbx [a] _ 125c 25c -25c 0 50 100 150 200 250 0 5 10 15 20 input voltage : v hin /v lin [v] input current : i hin /i lin [a] _ 125c 25c -25c 0 5 10 15 20 0.6 0.7 0.8 0.9 1.0 1.1 1.2 input voltage : v pgnd [v] internal logical voltage : v out [v] 125c 25c -25c
11/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 typical performance curves (reference data) - continued figure 23. release time figure 24. fault output on resistance (no external capacitor) figure 21. thermal shut down figure 22. noise masking time 0 5 10 15 20 100 110 120 130 140 150 160 170 180 junction temperature : tj [c] internal logical voltage : v out [v] 0 2 4 6 8 -25 0 25 50 75 100 125 junction temperature : tj [c] noise masking time : t mask [s] tsd uvlo ocp 0 10 20 30 40 50 -25 0 25 50 75 100 125 junction temperature : tj [c] release time : t release [s] tsd uvlo ocp 0.0 0.2 0.4 0.6 0.8 1.0 0246810 output current : i fob [ma] output voltage : v fob [v] 125c 25c -25c
12/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 typical performance curves (reference data) - continued figure 27. minimum input pulse width figure 28. input/output propagation delay (on delay) figure 25. under voltage lock out figure 26. under voltage lock out (high side driver, each phase) (low side drivers) 0 5 10 15 20 8 9 10 11 12 13 supply voltage : vcc [v] internal logical output voltage : v out [v] 125c 25c -25c 125c 25c -25c 0 500 1000 1500 12 13 14 15 16 17 18 supply voltage : vcc [v] input/output propagation delay : td on [ns] solid : low side dashed : high side 0 500 1000 1500 12 13 14 15 16 17 18 supply voltage : vcc [v] minimum input pulse width : t pwmin [ns] solid : low side dashed : high side 0 5 10 15 20 8 9 10 11 12 13 supply voltage : v bx - v x [v] internal logical voltage : v out [v] 125c 25c -25c 125c 25c -25c
13/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 typical performance curves (reference data) - continued figure 31. bootstrap diode forward voltage figure 32. bootstrap series resistor figure 29. output mosfet on resistance figure 30. output mosfet body diode 0 2 4 6 8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 drain current : i ds [a] output on resistance : r dson [ohm] 125c 25c -25c 0.0 0.5 1.0 1.5 2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 source current : i sd [a] forward voltage : v sd [v] -25c 25c 125c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0246810 bootstrap diode current : i bd [ma] forward voltage : v fbd [v] -25c 25c 125c 0 1 2 3 4 0246810 bootstrap series resistor current : i br [ma] voltage : v bootr [v] 125c 25c -25c
14/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 typical performance curves (reference data) - continued figure 35. low side switching loss figure 36. low side recovery loss (vdc=300v) (vdc=300v) figure 33. high side switching loss figure 34. high side recovery loss (vdc=300v) (vdc=300v) 0 5 10 15 0.0 0.5 1.0 1.5 2.0 2.5 drain current : i o [a] e [j] -25c 25c 125c 0 50 100 150 200 250 300 0.0 0.5 1.0 1.5 2.0 2.5 drain current : i o [a] e [j] 125c 25c -25c eon eoff 0 5 10 15 0.0 0.5 1.0 1.5 2.0 2.5 drain current : i o [a] e [j] -25c 25c 125c 0 50 100 150 200 250 300 0.0 0.5 1.0 1.5 2.0 2.5 drain current : i o [a] e [j] 125c 25c -25c eon eoff
15/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 application circuit example figure 37. application circuit example (150 commutation driver) parts list parts value manufacturer type parts value ratings type ic1 - rohm bm6203fs c1 0.1f 50v ceramic ic2 - rohm bd62012fs c2~4 2200pf 50v ceramic r1 1k ? rohm mcr18ezpf1001 c5 10? f 50v ceramic r2 150 ? rohm mcr18ezpj151 c6 10? f 50v ceramic r3 22k ? rohm mcr18ezpf2202 c7~9 1f 50v ceramic r4 100k ? rohm mcr18ezpf1003 c10 0.1f 50v ceramic r5 100k ? rohm mcr18ezpf1003 c11 1f 50v ceramic r6 0.5? rohm mcr50jzhfl1r50 // 3 c12 100pf 50v ceramic r7 10k ? rohm mcr18ezpf1002 c13 0.1f 630v ceramic r8 0 ? rohm mcr18ezpj000 c14 0.1f 50v ceramic r9 0 ? rohm mcr18ezpj000 hx - - hall elements q1 - rohm dtc124eua d1 - rohm kdz20b r8 r9 vreg vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc ic2 ic1 r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14
16/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 interfaces figure 38. uh, ul, vh, vl , wh, wl figure 39. pgnd figure 40. fob figure 41. vcc, g nd, vdc, bx(bu/bv/ bw), x(u/v/w) vreg 100k vh vl uh ul wh wl pgnd vreg fob vcc gnd x bx pgnd vdc
17/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage be low that of the ground pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver outputs, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user sh ould make sure that such voltages going below ground will not cause the ic and the system to malfunction by examining care fully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of the applic ation board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be excee ded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that t he internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capaci tors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it fr om the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
18/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 11. unused input pins input pins of an ic are often connect ed to the gate of a mos transistor. t he gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unle ss otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic do not force voltage to the input pins when the power does not supply to the ic. also, do not force voltage to the input pins that exceed the supply voltage or in t he guaranteed the absolute maximum rating va lue even if the power is supplied to the ic. when using this ic, the high voltage pins vdc, bu/u, bv/v and bw/w need a resin coating between these pins. it is judged that the inter-pins distance is not enough. if any spec ial mode in excess of absolute maximum ratings is to be implemented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage-clamping diodes or fuses. and, set the output transistor so that it does not exceed absolute maximum ratings or aso. in the event a large capacitor is connected between t he output and ground, and if vcc and vdc are short-circuited with 0v or ground for any reason, the current charged in the capacitor flows into the output and may destroy the ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric const ant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso).
19/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 physical dimension, tape and reel information package name ssop-a54_23 (unit : mm) pkg : ssop-a54_23
20/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 ordering information marking diagram b m 6 2 0 3 f s - e 2 rohm part number bm6203 : 600v/2.5a package fs : ssop-a54_23 packaging specification e2 : embossed taping bm6203fs 1pin mark lot number part number marking ssop-a54_23 (top view)
21/21 datasheet datasheet bm6203fs tsz02201-0828ab400110-1-2 ? 2013 rohm co., ltd. all rights reserved. 25.jul.2013 rev.001 http://www.rohm.com tsz22111 15 001 revision history date revision changes 25.jul.2013 001 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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